Question

which of the following thermal solutions might you find on memory modules?
active heat sink
surface area dissipation
liquid cooling
passive heat sink
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Explanation:

Passive heat sinks are commonly used on memory modules as they are simple, cost - effective, and do not require additional power for operation. Active heat sinks need fans and power, surface area dissipation is a general concept not a specific solution, and liquid cooling is complex and usually not used for just memory modules.

Answer:

Passive heat sink